Electrical analysis of TSV step change in radius with compensation structure. - Junping Zheng; Gang Dong; Yintang Yang; Yingbo Zhao; Qingyang Fan (IEICE Electron. Express, 2015)

Analysis of high power microwave induced degradation and damage effects in AlGaAs/InGaAs pHEMTs. - Xinhai Yu; Changchun Chai; Yang Liu 106; Yintang Yang; Qingyang Fan (Microelectron. Reliab., 2015)

Ku band damage characteristics of GaAs pHEMT induced by a front-door coupling microwave pulse. - Yang Liu 106; Changchun Chai; Qingyang Fan; Chunlei Shi; Xiaowen Xi; Xinhai Yu; Yintang Yang (Microelectron. Reliab., 2016)

Joint Service Caching and Computation Offloading to Maximize System Profits in Mobile Edge-Cloud Computing. - Qingyang Fan; Junyu Lin; Guangsheng Feng; Zihan Gao; Huiqiang Wang; Yafei Li (MSN, 2020)

Frequency-Dependent Characteristics and Parametric Modeling of the Silicon Substrate in TSV-Based 3-D ICs. - Yingbo Zhao; Qingyang Fan (IEEE Access, 2022)

Cooperative Service Caching in Vehicular Edge Computing Networks Based on Transportation Correlation Analysis. - Chen Ling 006; Weizhe Zhang; Qingyang Fan; Zebang Feng; Jiayin Wang; Rahul Yadav; Desheng Wang 002 (IEEE Internet Things J., 2024)

Mobility-Aware Cooperative Service Caching for Mobile Augmented Reality Services in Mobile Edge Computing. - Qingyang Fan; Weizhe Zhang; Chen Ling 006; Rahul Yadav; Desheng Wang 002; Hui He (IEEE Trans. Veh. Technol., 2024)