A 135 GBps/Gbit 0.66 pJ/bit Stacked Embedded DRAM with Multilayer Arrays by Fine Pitch Hybrid Bonding and Mini-TSV. - Song Wang; Bing Yu; Wenwu Xiao; Fujun Bai; Xiaodong Long; Liang Bai; Xuerong Jia; Fengguo Zuo; Jie Tan; Yixin Guo; Peng Sun; Jun Zhou; et al. (VLSI Technology and Circuits, 2023)