DeePEB: A Neural Partial Differential Equation Solver for Post Exposure Baking Simulation in Lithography. - Qipan Wang; Xiaohan Gao; Yibo Lin; Runsheng Wang; Ru Huang 001 (ICCAD, 2022)

MTL-Designer: An Integrated Flow for Analysis and Synthesis of Microstrip Transmission Line. - Qipan Wang; Ping Liu; Liguo Jiang; Mingjie Liu; Yibo Lin; Runsheng Wang; Ru Huang 001 (DAC, 2023)

ATPlace2.5D: Analytical Thermal-Aware Chiplet Placement Framework for Large-Scale 2.5D-IC. - Qipan Wang; Xueqing Li; Tianyu Jia; Yibo Lin; Runsheng Wang; Ru Huang 001 (ICCAD, 2024)

FaStTherm: Fast and Stable Full-Chip Transient Thermal Predictor Considering Nonlinear Effects. - Tianxiang Zhu; Qipan Wang; Yibo Lin; Runsheng Wang; Ru Huang 001 (ICCAD, 2024)

MORE-Stress: Model Order Reduction based Efficient Numerical Algorithm for Thermal Stress Simulation of TSV Arrays in 2.5D/3D IC. - Tianxiang Zhu; Qipan Wang; Yibo Lin; Runsheng Wang; Ru Huang 001 (DATE, 2025)