A big data-driven root cause analysis system: Application of Machine Learning in quality problem solving. - Qiuping Ma; Hongyan Li 005; Anders Thorstenson (Comput. Ind. Eng., 2021)

RLC Parameters Measurement and Fusion for High-Sensitivity Inductive Sensors. - Dong Liu; Hong Zhang 003; Xiaoting Xiao; Qiuping Ma; Haoran Li; Guiyun Tian 001; Bin Gao 003; Jianbo Wu (IEEE Trans. Instrum. Meas., 2022)

Structural Coupled Electromagnetic Sensing of Defects Diagnostic System. - Gaige Ru; Bin Gao 003; Dong Liu; Qiuping Ma; Haoran Li; Wai Lok Woo (IEEE Trans. Ind. Electron., 2023)

A decision support system for supplier quality evaluation based on MCDM-aggregation and machine learning. - Qiuping Ma; Hongyan Li 005 (Expert Syst. Appl., 2024)

Enhanced High-Sensitivity Eddy Current Technology for In-Line Pipeline Inspection and Imaging with Superior Resolution. - Qiuping Ma; Jiaqi Zhou; Xumei Yang; Chao Chang; Rui Chen; Qin Tang; Zhaohu Yu; Bin Gao 003; Guiyun Tian 001 (I2MTC, 2025)

Physical Coupling Fusion of Electromagnetic Acoustic Guided Wave With "Near-Zero" Magnetic Sensing System for Multitype Defect Detection. - Qin Tang; Bin Gao 003; Qiuping Ma; Gaige Ru; Songwen Xue; Wenze Shi; Fei Luo; Wai Lok Woo (IEEE Trans. Instrum. Meas., 2025)

Novel Impedance Sensing via Semiconductor Strain Gauge and Magnetic Resonant Coupling for Wireless Force Measurement. - Changrong Yang; Gui-Yun Tian 001; Mark Robinson; Qiuping Ma; Lawal Umar Daura; Emmanuel Tashiwa Ibrahim (IEEE Trans. Instrum. Meas., 2025)

Corrections to "Novel Impedance Sensing via Semiconductor Strain Gauge and Magnetic Resonant Coupling for Wireless Force Measurement". - Changrong Yang; Gui-Yun Tian 001; Mark Robinson; Qiuping Ma; Lawal Umar Daura; Emmanuel Tashiwa Ibrahim (IEEE Trans. Instrum. Meas., 2025)