Low-temperature direct and indirect bonding using plasma activation for 3D integration. - Shicheng Zhou; Xiaoyun Qi; Qiushi Kang; Chenxi Wang (ICTA, 2020)

Moiré-Based Nanoprecision Bonding Alignment System for Hybrid Integration. - Xiaoyun Qi; Han Yan; Shicheng Zhou; Qiushi Kang; Chenxi Wang (ICTA, 2021)

Cooperative surface-activation strategy for low-temperature Cu/SiO2 hybrid bonding. - Qiushi Kang; Ge Li; Fanfan Niu; Chenxi Wang (ICTA, 2022)