High-Precision Thickness Measurement of Cu Film on Si-Based Wafer Using Erasable Printed Eddy Current Coil and High-Sensitivity Associated Circuit Techniques. - Zilian Qu; Wensong Wang; Zhengchun Yang; Qiwen Bao; Yuanjin Zheng (IEEE Trans. Ind. Electron., 2022)

High-Sensitivity Signal Processing Circuit Integrated Coil Antenna Sensor Toward Measurements of the Water Fraction in the Oil-Water Two-Phase Flow. - Zilian Qu; Qiwen Bao; Zhengchun Yang; Zhenyu Zhao 001; Qinghai Yang; Shuhui Yang; Zengrui Li; Wensong Wang (IEEE Trans. Instrum. Meas., 2023)

High-Precision Resistivity Measurement of Silicon Wafer Under Unstable Lift-Off Distance Using Inductive and Laser Sensors-Integrated Probe. - Zilian Qu; Wensong Wang; Zhengchun Yang; Qiwen Bao; Xueli Li (IEEE Trans. Instrum. Meas., 2023)

A Time-Division Multiplexing Multi-Channel Micro-Electrochemical Workstation with Carbon-Based Material Electrodes for Online L-Trosine Detection. - Qiwen Bao; Gang Li 002; Zhengchun Yang; Jun Wei; Wenbo Cheng; Zilian Qu; Ling Lin 003 (Sensors, 2023)