Efficient damage sensitivity analysis of advanced Cu/low-k bond pad structures by means of the area release energy criterion. - Olaf van der Sluis; R. A. B. Engelen; Richard B. R. van Silfhout; W. D. van Driel; Marcel A. J. van Gils (Microelectron. Reliab., 2007)

Numerical analysis of delamination and cracking phenomena in multi-layered flexible electronics. - Olaf van der Sluis; R. A. B. Engelen; P. H. M. Timmermans; G. Q. Zhang (Microelectron. Reliab., 2009)

Prediction of the epoxy moulding compound aging effect on package reliability. - Sander Noijen; Roy Engelen; Joerg Martens; Alexandru Opran; Olaf van der Sluis; Richard B. R. van Silfhout (Microelectron. Reliab., 2010)