Decision support for the economic evaluation of systems integration. - R. Eisele; C. Hausen; T. Schwan (ECIS, 1995)

Strength and reliability of low temperature transient liquid phase bonded Cu-Sn-Cu interconnects. - Mads Brincker; S. Söhl; R. Eisele; Vladimir N. Popok (Microelectron. Reliab., 2017)

Low temperature transient liquid phase bonded Cu-Sn-Mo and Cu-Sn-Ag-Mo interconnects - A novel approach for hybrid metal baseplates. - Mads Brincker; Peter Kjær Kristensen; S. Söhl; R. Eisele; Vladimir N. Popok (Microelectron. Reliab., 2018)