Structural optimization under overhang constraints imposed by additive manufacturing technologies. - Grégoire Allaire; Charles Dapogny; R. Estevez; Alexis Faure; George Michailidis (J. Comput. Phys., 2017)

Characterization of materials and their interfaces in a direct bonded copper substrate for power electronics applications. - A. Ben Kabaar; Cyril Buttay; O. Dezellus; R. Estevez; Anthony Gravouil; Laurent Gremillard (Microelectron. Reliab., 2017)