Effect of solder creep on the reliability of large area die attachment. - W. D. Zhuang; P. C. Chang; F. Y. Chou; R. K. Shiue (Microelectron. Reliab., 2001)

The reliability study of selected Sn-Zn based lead-free solders on Au/Ni-P/Cu substrate. - R. K. Shiue; L. W. Tsay; C. L. Lin; J. L. Ou (Microelectron. Reliab., 2003)