Lifetime prediction modeling of non-insulated TO-220AB packages with lead-based solder joints during power cycling. - Sébastien Jacques; A. Caldeira; N. Batut; A. Schellmanns; R. Leroy; L. Gonthier (Microelectron. Reliab., 2012)

Impact of aluminum wire and ribbon bonding technologies on D2PAK package reliability during thermal cycling applications. - Sébastien Jacques; R. Leroy; Marc Lethiecq (Microelectron. Reliab., 2015)