Cratering response method to study the effect of ultrasonic energy on Cu-wire bonding quality. - R. T. H. Rongen; A. van IJzerloo; C. Cotofana; K. M. Lan (Microelectron. Reliab., 2011)

Reliability of Wafer Level Chip Scale Packages. - R. T. H. Rongen; R. Roucou; P. J. vd Wel; F. C. Voogt; F. Swartjes; Kirsten Weide-Zaage (Microelectron. Reliab., 2014)

Simulation and measurement of the flip chip solder bumps with a Cu-plated plastic core. - Kirsten Weide-Zaage; J. Schlobohm; R. T. H. Rongen; F. C. Voogt; R. Roucou (Microelectron. Reliab., 2014)