Reliability of Au/Al bonding in plastic packages for high temperature (200degreeC) and high current applications. - C. Passagrilli; L. Gobbato; R. Tiziani (Microelectron. Reliab., 2002)

Adhesive die attach for power application: Performance and reliability in plastic package. - R. Tiziani; G. Passoni; G. Santospirito (Microelectron. Reliab., 2002)

Pad Over Active (POA) solutions for three metal level BCD5 mixed power process - Design and validation of ESD protections. - A. Andreini; C. Neva; L. Renard; G. Sironi; F. Speroni; Luca Sponton; F. Tampellini; R. Tiziani (Microelectron. Reliab., 2003)