Packaging Technology for Electronic Applications in Harsh High-Temperature Environments. - Ping Hagler; Phillip Henson; R. Wayne Johnson (IEEE Trans. Ind. Electron., 2011)

Accelerated aging and thermal cycling of low melting temperature alloys as wet thermal interface materials. - Chandan K. Roy; Sushil Bhavnani; Michael C. Hamilton; R. Wayne Johnson; Roy W. Knight; Daniel K. Harris (Microelectron. Reliab., 2015)