Thermally stable, packaged aware LV HKMG platforms benchmark to enable low power I/O for next 3D NAND generations. - Alessio Spessot; Shairfe Muhammad Salahuddin; Ricardo Escobar; Romain Ritzenthaler; Yang Xiang; Rahul Budhwani; Eugenio Dentoni Litta; Elena Capogreco; Joao P. Bastos; Yangyin Chen; Naoto Horiguchi (IMW, 2022)