Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept. - Mike Roellig; Rainer Dudek; Steffen Wiese; Bjoern Boehme; Bernhard Wunderle; Klaus-Jürgen Wolter; Bernd Michel (Microelectron. Reliab., 2007)

An approach of numerical multi-objective optimization in stacked packaging. - Lukasz Dowhan; Artur Wymyslowski; Rainer Dudek (Microelectron. Reliab., 2008)

Simulation based analysis of secondary effects on solder fatigue. - Rainer Dudek; Ralf Döring; Christine Bombach; Bernd Michel (Microelectron. Reliab., 2009)

Studies on the reliability of power packages based on strength and fracture criteria. - Rainer Dudek; Reinhard Pufall; Bettina Seiler; Bernd Michel (Microelectron. Reliab., 2012)

Degradation of moulding compounds during highly accelerated stress tests - A simple approach to study adhesion by performing button shear tests. - Reinhard Pufall; Michael Goroll; Joachim Mahler; Werner Kanert; M. Bouazza; Olaf Wittler; Rainer Dudek (Microelectron. Reliab., 2012)

Effect of moisture swelling on MEMS packaging and integrated sensors. - J. Keller; Raul Mrossko; H. Dobrinski; J. Stürmann; Ralf Döring; Rainer Dudek; Sven Rzepka; Bernd Michel (Microelectron. Reliab., 2013)

On the crack and delamination risk optimization of a Si-interposer for LED packaging. - Jürgen Auersperg; Rainer Dudek; R. Jordan; O. Bochow-Neß; Sven Rzepka; Bernd Michel (Microelectron. Reliab., 2014)

Investigation on thermal fatigue of SnAgCu, Sn100C, and SnPbAg solder joints in varying temperature environments. - Jonas Johansson; Ilja Belov; Erland Johnson; Rainer Dudek; Peter Leisner (Microelectron. Reliab., 2014)

Combined simulation and optical measurement technique for investigation of system effects on components solder fatigue. - Rainer Dudek; M. Hildebrand; Sven Rzepka; T. Fries; Ralf Döring; Bettina Seiler; R. W. Ortmann (Microelectron. Reliab., 2018)