High temperature storage reliability investigation of the Al-Cu wire bond interface. - Rainer Pelzer; Michael Nelhiebel; Robert Zink; Stefan Wöhlert; Alice Lassnig; Golta Khatibi (Microelectron. Reliab., 2012)

Application of quantitative modal analysis for investigation of thermal degradation of microelectronic packages. - Peyman Rafiee; Golta Khatibi; N. Nelhiebel; Rainer Pelzer (Microelectron. Reliab., 2013)

High cycle fatigue testing of thermosonic ball bonds. - Alice Lassnig; Martin Lederer; Golta Khatibi; Rainer Pelzer; W. Robl; Michael Nelhiebel (Microelectron. Reliab., 2017)