Investigation of delaminations during thermal stress: scanning acoustic microscopy covering low and high temperatures. - P. Rajamand; Rainer Tilgner; Roland Schmidt; J. Baumann; P. Klofac; M. Rothenfusser (Microelectron. Reliab., 2003)

Effect of long and short Pb-free soldering profiles of IPC/JEDEC J-STD-020 on plastic SMD packages. - Peter Alpern; Kheng Chooi Lee; Rainer Tilgner (Microelectron. Reliab., 2004)

Numerical evaluation of miniaturized resistive probe for quantitative thermal near-field microscopy of thermal conductivity. - Andreas Altes; Rainer Tilgner; W. Walter (Microelectron. Reliab., 2006)

Advanced thermal failure analysis and reliability investigations - Industrial demands and related limitations. - Andreas Altes; Rainer Tilgner; Markus Reissner; Grazyna Steckert; Gerald Neumann (Microelectron. Reliab., 2008)