Characterization of copper precipitates on aluminum copper bond pads formed after plasma clean and de-ionized water exposure. - Raj Sekar Sethu; Hong Seng Ng; Alvin Chan; Cheng Nee Ong; Sieng Fong Chan (Microelectron. Reliab., 2015)

Reliability evaluation of tungsten donut-via as an element of the highly robust metallization. - Verena Hein; Marco Erstling; Raj Sekar Sethu; Kirsten Weide-Zaage; Tianlin Bai (Microelectron. Reliab., 2016)