Simulation based analysis of secondary effects on solder fatigue. - Rainer Dudek; Ralf Döring; Christine Bombach; Bernd Michel (Microelectron. Reliab., 2009)

Effect of moisture swelling on MEMS packaging and integrated sensors. - J. Keller; Raul Mrossko; H. Dobrinski; J. Stürmann; Ralf Döring; Rainer Dudek; Sven Rzepka; Bernd Michel (Microelectron. Reliab., 2013)

Combined simulation and optical measurement technique for investigation of system effects on components solder fatigue. - Rainer Dudek; M. Hildebrand; Sven Rzepka; T. Fries; Ralf Döring; Bettina Seiler; R. W. Ortmann (Microelectron. Reliab., 2018)