Time resolved determination of electrical field distributions within dynamically biased power devices by spectral EBIC investigations. - A. Pugatschow; Ralf Heiderhoff; L. J. Balk (Microelectron. Reliab., 2007)

Finite element analyses assisted Scanning Joule Expansion Microscopy on interconnects for failure analysis and reliability investigations. - A.-K. Tiedemann; K. Kurz; M. Fakhri; Ralf Heiderhoff; J. C. H. Phang; L. J. Balk (Microelectron. Reliab., 2009)

Nanoscale thermally induced stress analysis by complementary Scanning Thermal Microscopy techniques. - M. Fakhri; A.-K. Geinzer; Ralf Heiderhoff; L. J. Balk (Microelectron. Reliab., 2010)

Dynamic Near-Field Scanning Thermal Microscopy on thin films. - Ralf Heiderhoff; H. Li; Thomas Riedl (Microelectron. Reliab., 2013)

From diffusive in-plane to ballistic out-of-plane heat transport in thin non-crystalline films. - Ralf Heiderhoff; T. Haeger; K. Dawada; Thomas Riedl (Microelectron. Reliab., 2017)