Material improvement for ultrathin-wafer handling in TSV creation and PECVD process. - Amadine Jouve; Wenbin Hong; D. Blumenshine; JoElle Dachsteiner; Rama Puligadda; Dongshun Bai; J. Diaz; David Henry (3DIC, 2009)

Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ZoneBOND™ temporary bonding process with room temperature peel debonding. - Alain Phommahaxay; Anne Jourdain; Greet Verbinnen; Tobias Woitke; Peter Bisson; Markus Gabriel; Walter Spiess; Alice Guerrero; Jeremy McCutcheon; Rama Puligadda; Pieter Bex; Axel Van den Eede; et al. (3DIC, 2011)