Effects Of Wafer Bonding And Thinning Processes On Electrical Performance Of Mos Devices. - Wenjiang Zeng; Huamao Lin; Xiaolin Zhang; Ramasamy Chockalingam; Wee Chong Heng; Sangki Hong; Narayanan Balasubramanian (Int. J. Comput. Eng. Sci., 2003)