A 0.29pJ/b 5.27Tb/s/mm UCIe Advanced Package Link in 3nm FinFET with 2.5D CoWoS Packaging. - Didem Turker Melek; R. Navinkumar; James Vandersand; Pyare Sarkar; BS Prakash; Adrian Leuciuc; Kevin Geary; Shaojun Ma; Chirag Mukesh Mehta; Shashi Jain; Basant Bothra; Pawan Sabharwal; et al. (ISSCC, 2025)