High Performance Packaged Electronics for the IBM ES9000TM Mainframe. - Arnold E. Barish; James P. Eckhardt; Mark D. Mayo; Walter A. Svarczkopf; Santosh P. Gaur; Rao R. Tummala (ICCD, 1991)

High-performance glass-ceramic/copper multilayer substrate with thin-film redistribution. - Rao R. Tummala; John U. Knickerbocker; Sarah H. Knickerbocker; L. Wynn Herron; Robert W. Nufer; Raj N. Master; Mark O. Neisser; Benedikt M. Kellner; Charles H. Perry; James N. Humenik; Thomas F. Redmond (IBM J. Res. Dev., 1992)

Multichip packaging-a tutorial. - Rao R. Tummala (Proc. IEEE, 1992)

System on Chip or System on Package? - Rao R. Tummala; Vijay K. Madisetti (IEEE Des. Test Comput., 1999)

Gigabit wireless: system-on-a-package technology. - Rao R. Tummala; Joy Laskar (Proc. IEEE, 2004)

Electrical modeling of Through Silicon and Package Vias. - Tapobrata Bandyopadhyay; Ritwik Chatterjee; Daehyun Chung; Madhavan Swaminathan; Rao R. Tummala (3DIC, 2009)

Trend from ICs to 3D ICs to 3D systems. - Rao R. Tummala; Venky Sundaram; Ritwik Chatterjee; P. Markodeya Raj; Nitesh Kumbhat; Vijay Sukumaran; Vikay Sridharan; Abhishek Choudury; Qiao Chen; Tapobrata Bandyopadhyay (CICC, 2009)

Analysis of glass interposer PDN and proposal of PDN resonance suppression methods. - Jonghyun Cho; Youngwoo Kim; Joungho Kim; Venky Sundaram; Rao R. Tummala (3DIC, 2013)

Failure analysis of through-silicon vias in free-standing wafer under thermal-shock test. - Xi Liu; Qiao Chen; Venkatesh Sundaram; Rao R. Tummala; Suresh K. Sitaraman (Microelectron. Reliab., 2013)

Analysis and optimization of a power distribution network in 2.5D IC with glass interposer. - Youngwoo Kim; Jonghyun Cho; Kiyeong Kim; Heegon Kim; Joungho Kim; Srikrishna Sitaraman; Venky Sundaram; Rao R. Tummala (3DIC, 2014)

System Scaling With Nanostructured Power and RF Components. - Markondeya Raj Pulugurtha; Himani Sharma; Srikrishna Sitaraman; Dibyajat Mishra; Rao R. Tummala (Proc. IEEE, 2017)

Miniaturized and high-performance RF packages with ultra-thin glass substrates. - Min Suk Kim; Markondeya Raj Pulugurtha; Youngwoo Kim; Gapyeol Park; Kyungjun Cho; Vanessa Smet; Venky Sundaram; Joungho Kim; Rao R. Tummala (Microelectron. J., 2018)