Migration issues in sintered-silver die attaches operating at high temperature. - Raphel Riva; Cyril Buttay; Bruno Allard; Pascal Bevilacqua (Microelectron. Reliab., 2013)

Packaging with Double-Side Cooling Capability for SiC Devices, Based on Silver Sintering. - Cyril Buttay; Raphel Riva; Bruno Allard; Marie-Laure Locatelli; Vincent Bley (IECON, 2018)