3-D thin chip integration technology - from technology development to application. - Thomas Fritzsch; Raul Mrossko; Tobias Baumgartner 003; Michael Toepper; Matthias Klein; Jürgen Wolf; Bernhard Wunderle; Herbert Reichl (3DIC, 2009)

Effect of moisture swelling on MEMS packaging and integrated sensors. - J. Keller; Raul Mrossko; H. Dobrinski; J. Stürmann; Ralf Döring; Rainer Dudek; Sven Rzepka; Bernd Michel (Microelectron. Reliab., 2013)

Stress impact of moisture diffusion measured with the stress chip. - Florian Schindler-Saefkow; Florian Rost; Alexander Otto; R. Pantou; Raul Mroßko; Bernhard Wunderle; Bernd Michel; Sven Rzepka; Jürgen Keller (Microelectron. Reliab., 2014)