How well can we assess thermally driven reliability issues in electronic systems today? Summary of panel held at the Therminic 2002. - Yogendra Joshi; Kaveh Azar; David L. Blackburn; Clemens J. M. Lasance; Ravi Mahajan; Jukka Rantala (Microelectron. J., 2003)

Cooling a Microprocessor Chip. - Ravi Mahajan; Chia-Pin Chiu; Greg Chrysler (Proc. IEEE, 2006)

Multi-die Integration Using Advanced Packaging Technologies. - Hyung-Jin Lee; Ravi Mahajan; Farhana Sheikh; Ramune Nagisetty; Manish Deo (CICC, 2020)

8 Tbps Co-Packaged FPGA and Silicon Photonics Optical IO. - Kaveh Hosseini; Edwin Kok; Sergey Y. Shumarayev; Chia-Pin Chiu; Arnab Sarkar 004; Asako Toda; Yanjing Ke; Allen Chan; Daniel Jeong; Mason Zhang; Sangeeta Raman; Thungoc Tran; et al. (OFC, 2021)

5.12 Tbps Co-Packaged FPGA and Silicon Photonics Interconnect I/O. - Kaveh Hosseini; Edwin Kok; Sergey Y. Shumarayev; Daniel Jeong; Allen Chan; Austin Katzin; Songtao Liu; Radek Roucka; Manan Raval; Minh Mac; Chia-Pin Chiu; Thungoc Tran; et al. (VLSI Technology and Circuits, 2022)

Driving Compute Scale-out Performance with Optical I/O Chiplets in Advanced System-in-Package Platforms. - Mark Wade; Chen Sun 003; Matt Sysak; Vladimir Stojanovic; Pooya Tadayon; Ravi Mahajan; Babak Sabi (HCS, 2023)

On the Impact of Warpage on BEOL Geometry and Path Delays in Fan-out Wafer-Level Packaging. - Dhruv Thapar; Arjun Chaudhuri; Christopher Bailey; Ravi Mahajan; Krishnendu Chakrabarty (DATE, 2025)