Heterogeneous integration of two-dimensional materials for on-chip optical interconnects. - Ren-Jye Shiue (2017)

AIM Process Design Kit (AIMPDKv2.0): Silicon Photonics Passive and Active Component Libraries on a 300mm Wafer. - Erman Timurdogan; Zhan Su 001; Christopher V. Poulton; Matthew J. Byrd; Simon Xin; Ren-Jye Shiue; Benjamin R. Moss; Ehsan S. Hosseini; Michael R. Watts (OFC, 2018)

APSUNY Process Design Kit (PDKv3.0): O, C and L Band Silicon Photonics Component Libraries on 300mm Wafers. - Erman Timurdogan; Zhan Su 001; Ren-Jye Shiue; Christopher V. Poulton; Matthew J. Byrd; Simon Xin; Michael R. Watts (OFC, 2019)

400G Silicon Photonics Integrated Circuit Transceiver Chipsets for CPO, OBO, and Pluggable Modules. - Erman Timurdogan; Zhan Su 001; Ren-Jye Shiue; Matthew J. Byrd; Christopher V. Poulton; Kenneth Jabon; Christopher DeRose; Benjamin R. Moss; Ehsan S. Hosseini; Ivan Duzevik; Michael Whitson; Ronald P. Millman; et al. (OFC, 2020)

Edge-Coupled Active and Passive Wafer-Scale Measurements on 300mm Silicon Photonics Wafers. - Kenneth M. Jabon; Christopher V. Poulton; Ren-Jye Shiue; Matthew J. Byrd; Zhan Su 001; Mohammad H. Teimourpour; Scott Breitenstein; Ronald P. Millman; Dogan A. Atlas; Michael R. Watts; Erman Timurdogan (OFC, 2021)

Passive Integrated Athermal (De)Multiplexers on 300 mm Silicon Photonics Wafers. - Yun Gao; Noah Pestana; Skylar Deckoff-Jones; Jiajiu Zheng; Jordan Goldstein; Andrew M. Netherton; Ren-Jye Shiue; Michael R. Watts; Christopher V. Poulton (OFC, 2023)

Multi-rate PAM4 Silicon Photonic Based Receiver Assembly with -10dBm iFEC Sensitivity at 226Gb/s/λ and 125mW/Ch CMOS TIA. - Mahdi Parvizi; Hao Song; Bahar Jalali; Masoud Madiseh; John Rogers; Tie Sun; Toshi Omori; Brandon Davis; Bernd Huebner; Mark Heimbuch; Michael Soskind; Md Jubayer Shawon; et al. (OFC, 2025)