Experimental determination of the Young's modulus of copper and solder materials for electronic packaging. - Frank Kraemer; Mike Roellig; René Metasch; Joseph Al Ahmar; Karsten Meier; Steffen Wiese (Microelectron. Reliab., 2018)

Validation of different SAC305 material models calibrated on isothermal tests using in-situ TMF measurement of thermally induced shear load. - Marta Kuczynska; Natalja Schafet; Ulrich Becker; René Metasch; Mike Roellig; Alexander Kabakchiev; Stefan Weihe (Microelectron. Reliab., 2018)