Copper wire interconnect reliability evaluation using in-situ High Temperature Storage Life (HTSL) tests. - Amar Mavinkurve; Leon Goumans; G. M. O'Halloran; Rene T. H. Rongen; Mark-Luke Farrugia (Microelectron. Reliab., 2014)

Moisture absorption and desorption in wafer level chip scale packages. - Kirsten Rongen; Amar Mavinkurve; M. Chen; P. J. van der Wel; F. Swartjes; Rene T. H. Rongen (Microelectron. Reliab., 2015)