3D integration of MEMS and CMOS via Cu-Cu bonding with simultaneous formation of electrical, mechanical and hermetic bonds. - Revanth Nadipalli; Ji Fan; Holden King Ho Li; Keng Hoong Wee; Hao Yu 001; Chuan Seng Tan (3DIC, 2011)

Design exploration of 3D stacked non-volatile memory by conductive bridge based crossbar. - Yuhao Wang 002; Chun Zhang; Revanth Nadipalli; Hao Yu 001; Roshan Weerasekera (3DIC, 2011)

High-speed CMOS image sensor for high-throughput lensless microfluidic imaging system. - Mei Yan; Xiwei Huang; Qixiang Jia; Revanth Nadipalli; Tongxi Wang; Yang Shang; Hao Yu 001; Minkyu Je; Kiat Seng Yeo (Sensors, Cameras, and Systems for Industrial and Scientific Applications, 2012)