Temperature profile effects in accelerated thermal cycling of SnPb and Pb-free solder joints. - Yan Qi; Rex Lam; Hamid R. Ghorbani; Polina Snugovsky; Jan K. Spelt (Microelectron. Reliab., 2006)

Comparison of Weibull small samples using Monte Carlo simulations. - Rex Lam; Jan K. Spelt (Qual. Reliab. Eng. Int., 2007)