TSV metrology and inspection challenges. - Ramakanth Alapati; Youssef Travaly; Jan Van Olmen; Ricardo Cotrin Teixeira; Jan Vaes; Marc van Cauwenbergh; Anne Jourdain; Greet Verbinnen; Gino Marcuccilli; Glenn Florence; Shay Wolfling; Christine Pelissier; et al. (3DIC, 2009)

Development of microtransformers using MCM and electronic packaging technologies. - M. M. Rocha; Antonio C. C. Telles; Ricardo Cotrin Teixeira (SBCCI, 2017)