Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods. - Willem D. van Driel; C. J. Liu; G. Q. Zhang; J. H. J. Janssen; Richard B. R. van Silfhout; Marcel A. J. van Gils; Leo J. Ernst (Microelectron. Reliab., 2004)

Prediction of crack growth in IC passivation layers. - Y. T. He; Marcel A. J. van Gils; Willem D. van Driel; G. Q. Zhang; Richard B. R. van Silfhout; Leo J. Ernst (Microelectron. Reliab., 2004)

Prediction of Delamination Related IC & Packaging Reliability Problems. - W. D. van Driel; Marcel A. J. van Gils; Richard B. R. van Silfhout; G. Q. Zhang (Microelectron. Reliab., 2005)

Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions. - Cadmus A. Yuan; Willem D. van Driel; Richard B. R. van Silfhout; Olaf van der Sluis; Roy A. B. Engelen; Leo J. Ernst; Fred van Keulen; G. Q. Zhang (Microelectron. Reliab., 2006)

Virtual qualification of moisture induced failures of advanced packages. - Marcel A. J. van Gils; W. D. van Driel; G. Q. Zhang; H. J. L. Bressers; Richard B. R. van Silfhout; X. J. Fan; J. H. J. Janssen (Microelectron. Reliab., 2007)

Efficient damage sensitivity analysis of advanced Cu/low-k bond pad structures by means of the area release energy criterion. - Olaf van der Sluis; R. A. B. Engelen; Richard B. R. van Silfhout; W. D. van Driel; Marcel A. J. van Gils (Microelectron. Reliab., 2007)

Molecular simulation on the material/interfacial strength of the low-dielectric materials. - Cadmus A. Yuan; Olaf van der Sluis; G. Q. (Kouchi) Zhang; Leo J. Ernst; Willem D. van Driel; Richard B. R. van Silfhout (Microelectron. Reliab., 2007)

Prediction of the epoxy moulding compound aging effect on package reliability. - Sander Noijen; Roy Engelen; Joerg Martens; Alexandru Opran; Olaf van der Sluis; Richard B. R. van Silfhout (Microelectron. Reliab., 2010)