Design Enablement of Fine Pitch Face-to-Face 3D System Integration using Die-by-Die Place & Route. - Giuliano Sisto; Peter Debacker; Rongmei Chen; Geert Van der Plas; Richard Chou; Eric Beyne; Dragomir Milojevic (3DIC, 2019)

Design And Sign-off Methodologies For Wafer-To-Wafer Bonded 3D-ICs At Advanced Nodes (invited). - Giuliano Sisto; Rongmei Chen; Richard Chou; Geert Van der Plas; Eric Beyne; Rod Metcalfe; Dragomir Milojevic (SLIP, 2021)