IBM System/390 air-cooled alumina thermal conduction module. - John U. Knickerbocker; George B. Leung; William R. Miller; Steven P. Young; Scott A. Sands; Richard F. Indyk (IBM J. Res. Dev., 1991)

Measurement of underfill interfacial and bulk fracture toughness in flip-chip packages. - Shrikant Swaminathan; Kamal K. Sikka; Richard F. Indyk; Tuhin Sinha (Microelectron. Reliab., 2016)