Design issues and considerations for low-cost 3D TSV IC technology. - Geert Van der Plas; Paresh Limaye; Abdelkarim Mercha; Herman Oprins; Cristina Torregiani; Steven Thijs; Dimitri Linten; Michele Stucchi; Guruprasad Katti; Dimitrios Velenis; Domae Shinichi; Vladimir Cherman; et al. (ISSCC, 2010)

Processing assessment and adhesion evaluation of copper through-silicon vias (TSVs) for three-dimensional stacked-integrated circuit (3D-SIC) architectures. - Y. Yang; Riet Labie; F. Ling; C. Zhao; A. Radisic; Jan Van Olmen; Youssef Travaly; Bert Verlinden; Ingrid De Wolf (Microelectron. Reliab., 2010)

Design Issues and Considerations for Low-Cost 3-D TSV IC Technology. - Geert Van der Plas; Paresh Limaye; Igor Loi; Abdelkarim Mercha; Herman Oprins; Cristina Torregiani; Steven Thijs; Dimitri Linten; Michele Stucchi; Guruprasad Katti; Dimitrios Velenis; Vladimir Cherman; et al. (IEEE J. Solid State Circuits, 2011)

Cu pumping in TSVs: Effect of pre-CMP thermal budget. - Ingrid De Wolf; Kris Croes; O. Varela Pedreira; Riet Labie; Augusto Redolfi; M. Van De Peer; Kris Vanstreels; C. Okoro; Bart Vandevelde; Eric Beyne (Microelectron. Reliab., 2011)

Diffusion growth of Cu3Sn phase in the bump and thin film Cu/Sn structures. - Biljana Dimcic; Riet Labie; Joke De Messemaeker; Kris Vanstreels; Kris Croes; Bert Verlinden; Ingrid De Wolf (Microelectron. Reliab., 2012)

Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components. - Bart Vandevelde; Filip Vanhee; Davy Pissoort; Lieven Degrendele; Johan de Baets; Bart Allaert; Ralph Lauwaert; Franco Zanon; Riet Labie; Geert Willems (Microelectron. Reliab., 2017)