Insights into device and material origins and physical mechanisms behind cross temperature in 3D NAND. - Milan Pesic; Bastien Beltrando; Tommaso Rollo; Cristian Zambelli; Andrea Padovani; Rino Micheloni; Rita Maji; Lisa Enman; Mark Saly; Yang Ho Bae; Jung-Bae Kim; Dong Kil Yim; et al. (IRPS, 2023)