Evaluation of unsaturated fluorocarbons for dielectric Etch applications. - Ritwik Chatterjee (2002)

Inter-Strata Connection Characteristics and Signal Transmission in Three-Dimensional (3D) Integration Technology. - Syed M. Alam; Robert E. Jones; Shahid Rauf; Ritwik Chatterjee (ISQED, 2007)

Electrical modeling of Through Silicon and Package Vias. - Tapobrata Bandyopadhyay; Ritwik Chatterjee; Daehyun Chung; Madhavan Swaminathan; Rao R. Tummala (3DIC, 2009)

Trend from ICs to 3D ICs to 3D systems. - Rao R. Tummala; Venky Sundaram; Ritwik Chatterjee; P. Markodeya Raj; Nitesh Kumbhat; Vijay Sukumaran; Vikay Sridharan; Abhishek Choudury; Qiao Chen; Tapobrata Bandyopadhyay (CICC, 2009)

Electrical modeling and characterization of through-silicon vias (TSVs) for 3-D integrated circuits. - Ioannis Savidis; Syed M. Alam; Ankur Jain; Scott Pozder; Robert E. Jones; Ritwik Chatterjee (Microelectron. J., 2010)

Interstratum Connection Design Considerations for Cost-Effective 3-D System Integration. - Syed M. Alam; Robert E. Jones; Scott Pozder; Ritwik Chatterjee; Shahid Rauf; Ankur Jain (IEEE Trans. Very Large Scale Integr. Syst., 2010)