Conformational Molecular Switches for Post-CMOS Nanoelectronics. - Alain E. Kaloyeros; Mircea R. Stan; Barry Arkles; Robert E. Geer; Eric T. Eisenbraun; James E. Raynolds; Anand Gadre; Yongqiang Xue; James Ryan (IEEE Trans. Circuits Syst. I Regul. Pap., 2007)

Monolithic Graphene Nanoribbon Electronics for Interconnect Performance Improvement. - Sansiri Tanachutiwat; Shuhong Liu; Robert E. Geer; Wei Wang 003 (ISCAS, 2009)

Electrical characterization of RF TSV for 3D multi-core and heterogeneous ICs. - Le Yu; Haigang Yang; Tom T. Jing; Min Xu; Robert E. Geer; Wei Wang 003 (ICCAD, 2010)

Controlling Interfacial Adhesion of Self-Assembled Polypeptide Fibrils for Novel Nanoelectromechanical System (NEMS) Applications. - Narender Rana; Christopher Kossow; Eric T. Eisenbraun; Robert E. Geer; Alain E. Kaloyeros (Micromachines, 2011)

Plenary speaker: Connectivity driven systems: On-chip, off-chip and in-between. - Robert E. Geer (SoCC, 2012)

Effects of Copper Plasticity on the Induction of Stress in Silicon from Copper Through-Silicon Vias (TSVs) for 3D Integrated Circuits. - Benjamin Backes; Colin McDonough; Larry Smith 004; Wei Wang 003; Robert E. Geer (J. Electron. Test., 2012)

An extendable multi-purpose 3D neuromorphic fabric using nanoscale memristors. - Harika Manem; Karsten Beckmann; Min Xu; Robert Carroll; Robert E. Geer; Nathaniel C. Cady (CISDA, 2015)

Fault localization in a 3D test assembly using voltage contrast imaging. - Robert Carroll; Robert E. Geer (Microelectron. J., 2019)