Thermal Conductivity of Dilute Indium-Mercury Superconducting Alloys. - George K. Chang; Robert E. Jones; Arnold M. Toxen (IBM J. Res. Dev., 1962)

Ferroelectric nonvolatile memories for embedded applications. - Robert E. Jones (CICC, 1998)

Reconfigurable FPGA for Network Performance Evaluation. - Pong P. Chu; Robert E. Jones (PDPTA, 1999)

Inter-Strata Connection Characteristics and Signal Transmission in Three-Dimensional (3D) Integration Technology. - Syed M. Alam; Robert E. Jones; Shahid Rauf; Ritwik Chatterjee (ISQED, 2007)

Tutorial 3: Process Technology Development and New Design Opportunities in 3D Integration Technology. - Robert E. Jones (ISQED, 2008)

Die/wafer stacking with reciprocal design symmetry (RDS) for mask reuse in three-dimensional (3D) integration technology. - Syed M. Alam; Robert E. Jones; Scott Pozder; Ankur Jain (ISQED, 2009)

Electrical modeling and characterization of through-silicon vias (TSVs) for 3-D integrated circuits. - Ioannis Savidis; Syed M. Alam; Ankur Jain; Scott Pozder; Robert E. Jones; Ritwik Chatterjee (Microelectron. J., 2010)

Interstratum Connection Design Considerations for Cost-Effective 3-D System Integration. - Syed M. Alam; Robert E. Jones; Scott Pozder; Ritwik Chatterjee; Shahid Rauf; Ankur Jain (IEEE Trans. Very Large Scale Integr. Syst., 2010)

Thermal-electrical co-optimisation of floorplanning of three-dimensional integrated circuits under manufacturing and physical design constraints. - Ankur Jain; Syed M. Alam; Scott Pozder; Robert E. Jones (IET Comput. Digit. Tech., 2011)