Room temperature wedge-wedge ultrasonic bonding using aluminum coated copper wire. - Rainer Dohle; Matthias Petzold; Robert Klengel; Holger Schulze; Frank Rudolf (Microelectron. Reliab., 2011)

Interface microstructure effects in Au thermosonic ball bonding contacts by high reliability wire materials. - Benjamin März; Andreas Graff; Robert Klengel; Matthias Petzold (Microelectron. Reliab., 2014)