Interconnect design and analysis for Through Silicon Interposers (TSIs). - Joseph Romen Cubillo; Roshan Weerasekera; Zaw Zaw Oo; En-Xiao Liu; Bob Conn; Surya Bhattacharya; Robert Patti (3DIC, 2011)

Advances in 3D integrated circuits. - Robert Patti (ISPD, 2011)

3D integrated circuits: Designing in a new dimension: Designer track. - Robert Patti (ICCAD, 2012)

Exploring DRAM organizations for energy-efficient and resilient exascale memories. - Bharan Giridhar; Michael Cieslak; Deepankar Duggal; Ronald G. Dreslinski; Hsing Min Chen; Robert Patti; Betina Hold; Chaitali Chakrabarti; Trevor N. Mudge; David T. Blaauw (SC, 2013)

Invited talk: Progress in 3D integrated circuits. - Robert Patti (3DIC, 2015)

Multi-ANN embedded system based on a custom 3D-DRAM. - Lee Baker; Robert Patti; Paul D. Franzon (3DIC, 2021)

Design Obfuscation Through 3-D Split Fabrication With Smart Partitioning. - Theodros Nigussie; Joshua Schabel; Steve Lipa; Lisa G. McIlrath; Robert Patti; Paul D. Franzon (IEEE Trans. Very Large Scale Integr. Syst., 2022)

A Direct Bond Interconnect 3D Co-Integrated Silicon-Photonic Transceiver in 12nm FinFET with -20.3dBm OMA Sensitivity and 691fJ/bit. - Anirban Samanta; Po-Hsuan Chang; Peng Yan; Mingye Fu; Mehmet Berkay On; Ankur Kumar; Hyungryul Kang; Il-Min Yi; Dedeepya Annabattuni; Yu Zhang 099; David Scott; Robert Patti; et al. (OFC, 2023)

A Sub-500fJ/bit 3D Direct Bond Silicon Photonic Transceiver in 12nm FinFET. - Po-Hsuan Chang; Anirban Samanta; Peng Yan; Mingye Fu; Yu Zhang 099; Mehmet Berkay On; Ankur Kumar; Hyungryul Kang; Il-Min Yi; Dedeepya Annabattuni; David Scott; Robert Patti; et al. (VLSI Technology and Circuits, 2023)

Advanced Packaging, Heterogeneous Integration, and Foundry 2.0. - Robert Patti (MWSCAS, 2024)