A flexible hierarchical 3-D module assembler. - Robi Dutta; Maurice Marks; Craig Morrissey; Ravi Rao; Lee Sapiro (EURO-DAC, 1990)

Algorithm for wire sizing of Power and Ground Networks in VLSI Designs. - Robi Dutta; Malgorzata Marek-Sadowska (J. Circuits Syst. Comput., 1992)

Topological routing to maximize routability for package substrate. - Shenghua Liu; Guoqiang Chen; Tom Tong Jing; Lei He 001; Tianpei Zhang; Robi Dutta; Xianlong Hong (DAC, 2008)

Diffusion-driven congestion reduction for substrate topological routing. - Shenghua Liu; Guoqiang Chen; Tom Tong Jing; Lei He 001; Robi Dutta; Xianlong Hong (ISPD, 2009)

Substrate Topological Routing for High-Density Packages. - Shenghua Liu; Guoqiang Chen; Tom Tong Jing; Lei He 001; Tianpei Zhang; Robi Dutta; Xianlong Hong (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2009)

Effective congestion reduction for IC package substrate routing. - Shenghua Liu; Guoqiang Chen; Tom Tong Jing; Lei He 001; Robi Dutta; Xianlong Hong (ACM Trans. Design Autom. Electr. Syst., 2010)