An Ultra-low-power 28nm CMOS Dual-die ASIC Platform for Smart Hearables. - Yu Pu; Danny Butterfield; Jorge Garcia; Jing Xie; Mark Lin; Rohit Sauhta; Rick Farley; Steve Shellhammer; Moses Derkalousdian; Adam Newham; Chunlei Shi; Ravi Shenoy; et al. (BioCAS, 2018)