Bump formation for flip chip and CSP by solder paste printing. - Joachim Kloeser; Paradiso Coskina; Rolf Aschenbrenner; Herbert Reichl (Microelectron. Reliab., 2002)

Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping. - Dionysios Manessis; Rainer Patzelt; Andreas Ostmann; Rolf Aschenbrenner; Herbert Reichl (Microelectron. Reliab., 2004)

Long time reliability study of soldered flip chips on flexible substrates. - Barbara Pahl; Christine Kallmayer; Rolf Aschenbrenner; Herbert Reichl (Microelectron. Reliab., 2004)

Embroidering Electrical Interconnects with Conductive Yarn for The Integration of Flexible Electronic Modules into Fabric. - Torsten Linz; Christine Kallmayer; Rolf Aschenbrenner; Herbert Reichl (ISWC, 2005)

Reliability Potential Of Epoxy Based Encapsulants For Automotive Applications. - Tanja Braun; Karl-Friedrich Becker; Mathias Koch; Volker Bader; Rolf Aschenbrenner; Herbert Reichl (Microelectron. Reliab., 2005)

Fully Integrated EKG Shirt based on Embroidered Electrical Interconnections with Conductive Yarn and Miniaturized Flexible Electronics. - Torsten Linz; Christine Kallmayer; Rolf Aschenbrenner; Herbert Reichl (BSN, 2006)

High-temperature reliability of Flip Chip assemblies. - Tanja Braun; Karl-Friedrich Becker; Mathias Koch; Volker Bader; Rolf Aschenbrenner; Herbert Reichl (Microelectron. Reliab., 2006)

From fan-out wafer to fan-out panel level packaging. - Tanja Braun; K.-F. Becker; S. Raatz; V. Bader; Jörg Bauer 002; Rolf Aschenbrenner; S. Voges; Tina Thomas; Ruben Kahle; Klaus-Dieter Lang (ECCTD, 2015)