Prediction of thermo-mechanical integrity of wafer backend processes. - Viktor Gonda; Jaap M. J. den Toonder; Johan Beijer; G. Q. Zhang; Willem D. van Driel; Romano J. O. M. Hoofman; Leo J. Ernst (Microelectron. Reliab., 2004)

A 7 μW Offset- and Temperature-Compensated pH-to-Digital Converter. - Saleh Heidary Shalmany; Matthias Merz; Ali Fekri; Zu-yao Chang; Romano J. O. M. Hoofman; Michiel A. P. Pertijs (J. Sensors, 2017)