Chip Substrate Resistance Modeling Technique for Integrated Circuit Design. - Thomas A. Johnson; Ronald W. Knepper; Victor Marcello; Wen Wang (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 1984)

Modeling and Experimental Measurement of Active Substrate-Noise Suppression in Mixed-Signal 0.18µm BiCMOS Technology. - Haitao Dai; Ronald W. Knepper (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2009)

A 300-V LDMOS Analog-Multiplexed Driver for MEMS Devices. - Shanshan Dai; Ronald W. Knepper; Mark N. Horenstein (IEEE Trans. Circuits Syst. I Regul. Pap., 2015)

Active C4 Electrodes for Local Field Potential Recording Applications. - Lu Wang; David S. Freedman; Mesut Sahin; M. Selim Ünlü; Ronald W. Knepper (Sensors, 2016)

Terahertz travelling wave amplifier design using Ballistic Deflection Transistor. - Huan Wang 009; Jean-François Millithaler; Ronald W. Knepper; Martin Margala (ISQED, 2018)

THz Ballistic Deflection Transistor Travelling Wave Amplifier Design with THz Ring Hybrid Coupler. - Huan Wang 009; Jean-François Millithaler; Martin Margala; Ronald W. Knepper (NEWCAS, 2018)

A Novel Terahertz Ballistic Deflection Transistor Travelling Wave Amplifier System. - Huan Wang 009; Ronald W. Knepper; Jean-François Millithaler; Martin Margala (IEEE Trans. Circuits Syst. II Express Briefs, 2018)