Response spectra analysis for undamped structural systems subjected to half-sine impact acceleration pulses. - Tsung-Yueh Tsai; Chang-Lin Yeh; Yi-Shao Lai; Rong-Sheng Chen (Microelectron. Reliab., 2007)

Finite element model verification for packaged printed circuit board by experimental modal analysis. - Ying-Chih Lee; Bor-Tsuen Wang; Yi-Shao Lai; Chang-Lin Yeh; Rong-Sheng Chen (Microelectron. Reliab., 2008)

Packaging parameter analysis and optimization design on solder joint reliability for twin die stacked packages by variance in strain energy density (SED) of each solder joint. - Chao-Yang Mao; Rong-Sheng Chen (Microelectron. Reliab., 2008)

Structural design optimization for board-level drop reliability of wafer-level chip-scale packages. - Tsung-Yueh Tsai; Yi-Shao Lai; Chang-Lin Yeh; Rong-Sheng Chen (Microelectron. Reliab., 2008)

Characteristics of ZnO thin films prepared by radio frequency magnetron sputtering. - Ping-Feng Yang; Hua-Chiang Wen; Sheng-Rui Jian; Yi-Shao Lai; Sean Wu; Rong-Sheng Chen (Microelectron. Reliab., 2008)

Interval optimal design of 3-D TSV stacked chips package reliability by using the genetic algorithm method. - Hsin-En Cheng; Rong-Sheng Chen (Microelectron. Reliab., 2014)

Packaging Parameters Analysis for the Fatigue Reliability of Stacked Chip Ball Grid Array by Using the Optimal Equivalent Solder Balls. - Hsin-En Cheng; Rong-Sheng Chen; Chao-Yang Mao (Qual. Reliab. Eng. Int., 2015)